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Analysis of Breakdown Voltages and Depletion Region Width of 4H-SiC Vertical Double Implanted MOSFET (ECE/EEE Project)

 

The semiconductor based electronic devices that can function at ambient temperatures higher than 1500C without external cooling system could greatly benefit a variety of application. When Silicon Power device work at a temperature above 2000C then it is problematic because of the self heating is increased, also the internal junction temperature and leakage increased. To work in high temperature with ease it is required to used high band gap devices. For all of these requirements Silicon devices are the optimum choices.
Due to various properties of Silicon carbide like lower intrinsic carrier concentration (10–35 orders of magnitude), higher electric breakdown field (4–20 times), higher thermal conductivity (3–13 times), larger saturated electron drift velocity (2–2.5 times) it replaces Si material very quickly in the semiconductor industry.
The fact that wide band gap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. 4H-SiC is a potentially useful material for high temperature devices because of its refractory nature, high thermal conductivity, wide band gap (2.2 eV) and high electron mobility comparable to that of Si.
The present work aims at the design of high breakdown voltage 10kV 4H-SiC DIMOSFET with Gaussian profile in drift region to show its characteristics and various properties. In Gaussian doping profile it is found that the height of drift region h at 10 KV is 102 μm. At that particular point the avalanche breakdown voltage is about 9.063 KV. The calculation of Depletion region Width at different breakdown voltage and at different height is to be done and corresponding graph is shown.

The semiconductor based electronic devices that can function at ambient temperatures higher than 1500C without external cooling system could greatly benefit a variety of application. When Silicon Power device work at a temperature above 2000C then it is problematic because of the self heating is increased, also the internal junction temperature and leakage increased. To work in high temperature with ease it is required to used high band gap devices. For all of these requirements Silicon devices are the optimum choices.
Due to various properties of Silicon carbide like lower intrinsic carrier concentration (10–35 orders of magnitude), higher electric breakdown field (4–20 times), higher thermal conductivity (3–13 times), larger saturated electron drift velocity (2–2.5 times) it replaces Si material very quickly in the semiconductor industry.
The fact that wide band gap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. 4H-SiC is a potentially useful material for high temperature devices because of its refractory nature, high thermal conductivity, wide band gap (2.2 eV) and high electron mobility comparable to that of Si.
The present work aims at the design of high breakdown voltage 10kV 4H-SiC DIMOSFET with Gaussian profile in drift region to show its characteristics and various properties. In Gaussian doping profile it is found that the height of drift region h at 10 KV is 102 μm. At that particular point the avalanche breakdown voltage is about 9.063 KV. The calculation of Depletion region Width at different breakdown voltage and at different height is to be done and corresponding graph is shown.

 

Airline Reservation System in VB.net (Computer Project)


This is a complete application for airline  reservation programmed in VB.net

   


Simple Car Sales System in JAVA (Computer Project) 

This is a simple project on Car Sales programmed in JAVA .
 








Multimedia Protection using Content and Embedded Fingerprints (Electronics Project)

Improved digital connectivity has made the Internet an important medium for multimedia distribution and consumption in recent years. At the same time, this increased proliferation of multimedia has raised significant challenges in secure multimedia distribution and intellectual property protection.
This dissertation examines two complementary aspects of the multimedia protection problem that utilize content fingerprints and embedded collusion-resistant fingerprints. The first aspect considered is the automated identification of multimedia using content fingerprints, which is emerging as an important tool for detecting copyright violations on user generated content websites. A content fingerprint is a compact identifier that captures robust and distinctive properties of multimedia content, which can be used for uniquely identifying the multimedia object.
In this dissertation, we describe a modular framework for theoretical modeling and analysis of content fingerprinting techniques. Based on this framework, we analyze the impact of distortions in the features on the corresponding fingerprints and also consider the problem of designing a suitable quantizer for encoding the features in order to improve the identification accuracy. The interaction between the fingerprint designer and a malicious adversary seeking to evade detection is studied under a game-theoretic framework and optimal strategies for both parties are derived.
We then focus on analyzing and understanding the matching process at the fingerprint level. Models for fingerprints with different types of correlations are developed and the identification accuracy under each model is examined. Through this analysis we obtain useful guidelines for designing practical systems and also uncover connections to other areas of research.
A complementary problem considered in this dissertation concerns tracing the users responsible for unauthorized redistribution of multimedia. Collusion-resistant fingerprints, which are signals that uniquely identify the recipient, are proactively embedded in the multimedia before redistribution and can be used for identifying the malicious users. We study the problem of designing collusion resistant fingerprints for embedding in compressed multimedia. Our study indicates that directly adapting traditional fingerprinting techniques to this new setting of compressed multimedia results in low collusion resistance. To withstand attacks, we propose an anti-collusion dithering technique for embedding fingerprints that significantly improves the collusion resistance compared to traditional fingerprints.

  

Low Power Smartdust Receiver with Novel Applications and Improvements of an RF Power Harvesting Circuit (Electronics Project)

Smartdust is the evolution of wireless sensor networks to cubic centimeter dimensions or less. Smartdust systems have advantages in cost, flexibility, and rapid deployment that make them ideal for many military, medical, and industrial applications.
This work addresses the limitations of prior works of research to provide sufficient lifetime and performance for Smartdust sensor networks through the design, fabrication and testing of a novel low power receiver for use in a Smartdust transceiver. Through the novel optimization of a multi-stage LNA design and novel application of a power matched Villard voltage doubler circuit, a 1.0 V, 1.6 mW low power On-Off Key (OOK) receiver operating at 2.2 GHz is fabricated using 0.13 um CMOS technology.
To facilitate data transfer in adverse RF propagation environments (1/r^3 loss), the chip receives a 1 Mbps data signal with a sensitivity of -90 dBm while consuming just 1.6 nJ/bit. The receiver operates without the addition of any external passives facilitating its application in Smartdust scale (mm^3) wireless sensor networks. This represents an order of magnitude decrease in power consumption over receiver designs of comparable sensitivity.
In an effort to further extend the lifetime of the Smartdust transceiver, RF power harvesting is explored as a power source. The small scale of Smartdust sensor networks poses unique challenges in the design of RF power scavenging systems. To meet these challenges, novel design improvements to an RF power scavenging circuit integrated directly onto CMOS are presented. These improvements include a reduction in the threshold voltage of diode connected MOSFET and sources of circuit parasitics that are unique to integrated circuits.
Utilizing these improvements, the voltage necessary to drive Smartdust circuitry (1 V) with a greater than 20% RF to DC conversion efficiency was generated from RF energy levels measured in the environment (66 uW). This represents better than double the RF to DC conversion efficiency of the conventional power matched RF energy harvesting circuit. The circuit is integrated directly onto a 130 nm CMOS process with no external passives and measures only 300 um by 600 um, meeting the strict form factor requirement of Smartdust systems.

FPGA Implementation of FFT Algorithm for IEEE 802.16e (Mobile WiMAX) (Electronics Project)

Mobile WiMAX (Worldwide Interoperability for Microwave Access) or 802.16e standard was ratified by the IEEE in late 2005 as a potential to emerge as a real viable competitor to existing 3G technologies.
Mobile WiMAX uses an OFDMA™ technology called 1K-FFT. Orthogonal Frequency-Division Multiple Access (OFDMA) is a multi-user version of the popular Orthogonal frequency-division multiplexing (OFDM) digital modulation scheme. In the widely used OFDM systems, the FFT and IFFT pairs are used to modulate and demodulate the data constellation on the subcarriers.
This paper presents a high level implementation of a high performance FFT for OFDM Modulator and Demodulator. The design has been coded in Verilog and targeted into Xilinx Spartan3 FPGAs. Radix-22 Algorithm is proposed and used for the OFDM communication system. This algorithm has the same multiplicative complexity as the radix-4 algorithm, but retains the butterfly structure of radix-2 algorithm.
 

 

Study of Solar/Biogas Hybrid Power Generation (Electronics Project)

This thesis proposes a solar photovoltaic and biogas hybrid system for generation of electricity to overcome from global warming effect, economic and statistical impact on prosperity and dependency.
The hybrid system energy has a higher reliability, can be cost effective and improve the quality of live in small town. we will redesign the power system with environment friendly. we will show that India can be great market for its production. At large scale and hybrid system will independently provide a stable power source and daily gas for small towns.
Hybrid power system that aims to increase the system efficiency and increase use of renewable energy based hybrid power system. In order to meet sustained load demands during varying natural conditions, different renewable energy sources need to be integrated with each other like solar, wind, ocean, geothermal, biomass/biogas, Bio diesel, wave energy, fuel cell technologies, waste of energy municipal waste/ liquid waste/Industrial waste, small hydro.
Thus we have seen that biogas is a promising tool for employment generation energy .self sufficiency and reduction of green house gases and recover global warming effect. Energy, Economy & Environment is the three inter-related areas having direct correlation for development of any nation. Per capita energy consumption is an index for development of any nation so we are tries to increase pre capita energy consumption in India with use of renewable energy source.

 

Microfabrication and Analysis of Manifold Microchannel Coolers for Power Electronics (Mechanical Project)

This research presents the analysis and realization of a single phase high performance manifold microchannel cooler for improving the thermal and hydrodynamic performance of multi-chip power electronic modules. This heat exchanger, microfabricated directly into the substrate, enables higher power density electronic products by more efficiently removing the high levels of heat generated.
The improved thermal performance and efficiency of the heat exchanger is demonstrated using both numerical and experimental techniques. The improved heat removal is due to the reduction in the number of packaging layers between the device and the heat exchanger and by improvement in convective heat transfer. In addition, the efficiency of the device is enhanced by minimizing fluid pressure drop through the use of large manifold channels to transport fluid to the cooling area and smaller crossover microchannels in the active cooling area. This combination of channels also improves the uniformity of the temperature distribution across the device.
The manifold microchannel coolers were fabricated and tested both with and without electrical isolation between the chip and the coolant. Experimentally, the coolers without electrical isolation demonstrated thermal resistivity values as low as 0.06 K/(W/cm2), which is up to a 50X improvement over a standard power package with significant size and weight reduction. The coolers with an incorporated aluminum nitride electrical isolation layer experimentally demonstrated up to a 15X improvement.
In addition to experimental results, the interaction between the manifold channels and multiple microchannels was numerically modeled and compared to simpler, one-dimensional approximations based on the Hagen-Poiseuille equation. The comparison shows that the one-dimensional model, while under-predicting total pressure drops, can provide insight into the effect of varying dimensions on system performance. The numerical models were used to identify the impact of varying dimensions across the entire length of the cooler, and a sensitivity analysis was performed with respect to system pressure drop, thermal resistance and uniformity. Additionally, large microchannel velocity gradients, some larger than 10X, were observed along the length of the device which impacts the chip non-uniformity. The simulations showed that when comparing the manifolded design to a comparable straight microchannel cooler, there is a 38X reduction in system pressure drop for similar thermal performance.
 



Reliability Assessment of Rolling Piston Rotary Type Compressors (Mechanical Project)

The performance of a compressor changes during its lifetime, depending on various parameters such as operating conditions, type of the compressor, working fluid and type of the oil being used. Most performance degradation of the compressor is due to wear on the moving mechanical parts inside the compression vessel. Wear develops on the contact point(s) or area(s) between the moving and fixed mechanical parts inside the compressor when there is a lack of lubrication.
In a rolling piston rotary compressor, the most vulnerable regions are the vane and roller contact area, and the shaft and journal bearing area. As the amount of wear increases, leakage through the clearances inside the compression compartment increases as well. An increase in the amount of leakage degrades the volumetric efficiency and the overall performance of the compressor.
The objectives of this study are to predict the life span of rolling piston rotary-type compressors through the measurement of wear on the roller under accelerated test conditions, and predict the effect of wear on the degradation of compressor performance. In order to be able to estimate the amount of wear under different operating pressures, a correlation between operating pressures, amount of wear, and degradation of performance was developed. Then the change in compressor performance was estimated using a computer simulation program which takes into account the effect of leakage through the clearances inside the compression vessel based on the operating conditions provided.
One unit of rolling piston rotary type compressor was tested under accelerated operating conditions. An initial increase in the capacity and volumetric efficiency of the compressor was achieved due to aging affects. Then the performance of the compressor started to degrade due to increase in the amount of refrigerant leakage from suction pocket to discharge pocket of the compression compartment.
 

 

Payroll Management System in JAVA (Computer Project)

Payroll Management System is a project built using Java language and MS Access. Payroll management software gives the power to: Manage employee information efficiently, define the emoluments, deductions, leave, tax etc, generate pay-slip at the convenience of a mouse click, generate and manage the payroll processes according to the salary structure assigned to the employee, etc.
Main files of this project are:
Addwindow.java
clsConnection.java
clsSettings.java
Deletewindow.java
Editwindow.java
Emprptwindow.java
LoginFrame.java
MainMenu.java
printwindow.java
Settingswindow.java

 

 

Mini Orkut Using JAVA (Computer Project)

This project is about developing a live chatting module based on the social networking site, Orkut. We studied the working of orkut in detail and tried to extract important features in our project. Basically our project works on LAN while the real orkut works on internet. But the basic idea behind it is the same, that is to provide the user with a enjoyable and good-to-look means of communication.
The real orkut provide the users with lot of options such as add as a friend ,write scraps, add to crush list, write testimonials, joining communities etc. but we plan to include only the basic options in our project which deal with communication purpose or rather the chatting purpose . Hence our project will contain basic functions like add as friend, write scraps and uploading photo.
To implement this project, sufficient knowledge of JAVA is needed. Along with that, knowledge of socket programming and JDBC is must. Lets see how they are implemented…
  • Socket programming is needed to connect PC’s together and exchange information between them.
  • The code of the project has to be done in JAVA hence knowledge of JAVA is must!!!!
  • Also all the information is to be stored in database, hence to connect the database with our source code, knowledge of JDBC is needed.